Friday, April 17, 2026

Fighting with the SLT contacts to solder them onto my 1627 plotter controller card

CONTACTS TURN AND TILT WHILE SOLDERING

I attempted the method of soldering one side using 183 C solder paste and hot air, so that I could add the other side's contacts using lower temp (138 C) paste without dislodging the first set. However, because my pad on the PCB does not match the shape of the contacts, as the solder melts the contacts are free to float and turn. 

I stopped heating the paste after the three rightmost ones melted and moved out of alignment. The left ones moved due to my touching them as I removed the board from the soldering area of my workshop. You can clearly see the square small pads that permit the contacts to move. Normally when a pad and the component are the same shape, the liquid tension of the melted solder will pull the part into perfect alignment. 

PROPER FIX IS REDRAWING THE CONTACTS ON THE PCB

I believe that I must redraw the contact pad on the PCB to match the actual contacts, then remake the board. That should give me the ability to solder these down properly. However, that involves some time, both to modify the KiCAD files, and to approach PCBWAY.COM who sponsored the first run of the boards to request a second build. 

NEAR TERM APPROACH WILL BE A JIG TO HOLD 12 CONTACTS IN PLACE

I have to figure out a jig that I could insert contacts for all 12 positions, hold them in place, set the assembly onto the PCB and then heat the solder paste to melting without destroying the jig. This will be complicated to work out, since the contacts, being springy, won't all have exactly the same shape. However, the jig must hold them so that the bottom contact area will be flat on the PCB in the right location. 

Thus there is a design and manufacturing complexity to such a jig that will hold all those contacts in the proper alignment. It also must not melt at temperatures up to about 200 C. Finally, it must allow the hot air to easily flow around the contact and the PCB so that the solder paste melts and then cools when hot air is removed.

If this is going to take longer than the time to get permission and then receive finished PCBs, it will be moot. Give me a day with my thinking cap on. 

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